Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang
| Main Author: | Hwang, Jennie S. |
|---|---|
| Format: | MONOGRAPHS |
| Language: | English |
| Published: |
New York : McGraw-Hill, 1996 |
| Series: |
Electronic packaging and interconnection series
|
| Subjects: |
Electronic apparatus and appliances.
Electronic packaging. Electronics. Solder and soldering. |
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| 001 | 0001896 | ||
| 003 | Th-MUT | ||
| 008 | 181106s9999 xx 000 0 eng d | ||
| 020 | |a 0070317496 |c 2175 | ||
| 040 | |a DLC |c MUT | ||
| 050 | 4 | |a TK7870.15 |b H93M63 | |
| 100 | 1 | |a Hwang, Jennie S. | |
| 245 | 1 | 0 | |a Modern solder technology for competitive electronics manufacturing |b / |c Jennie S. Hwang |
| 260 | |a New York : |b McGraw-Hill, |c 1996 | ||
| 300 | |a xliv, 622 p. : |b illus., graphs, tables ; |c 23 cm. | ||
| 440 | 0 | |a Electronic packaging and interconnection series | |
| 504 | |a Includes bibliographical references and index. | ||
| 650 | 0 | |a Electronic apparatus and appliances. | |
| 650 | 0 | |a Electronic packaging. | |
| 650 | 0 | |a Electronics. | |
| 650 | 0 | |a Solder and soldering. | |
| 991 | |a MONOGRAPHS |b 5 |c 2018-11-07 00:29:18 |d 2021-11-06 14:38:07 |e mut |f n |g null |h n |i a |j m |k |l a |m |n a |o |p b |q |r nyu |s eng |t 1996 |v Modern solder technology for competitive electronics manufacturing / | ||