Modern solder technology for competitive electronics manufacturing / Jennie S. Hwang
| Main Author: | Hwang, Jennie S. |
|---|---|
| Format: | MONOGRAPHS |
| Language: | English |
| Published: |
New York : McGraw-Hill, 1996 |
| Series: |
Electronic packaging and interconnection series
|
| Subjects: |
Electronic apparatus and appliances.
Electronic packaging. Electronics. Solder and soldering. |
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