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RF measurements of die and packages / Scott A. Wartenberg

Main Author: Wartenberg, Scott A.
Format: MONOGRAPHS
Language: English
Published: Boston, MA. : Artech House, 2002
Series: Artech house microwave library
Subjects: Integrated circuits
Microelectronic packaging.
Radio measurements.
Very high speed integrated circuits
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001 0032003
003 Th-MUT
008 181106s9999 xx 000 0 eng d
020 |a 9781580532730  |c 3225 
040 |a DLC  |c MUT 
050 4 |a TK7874.7  |b W37R45 
100 1 |a Wartenberg, Scott A. 
245 1 0 |a RF measurements of die and packages  |b /  |c Scott A. Wartenberg 
260 |a Boston, MA. :  |b Artech House,  |c 2002 
300 |a 224 p. :  |c 24 cm. 
440 0 |a Artech house microwave library 
650 0 |a Integrated circuits 
650 0 |a Microelectronic packaging. 
650 0 |a Radio measurements. 
650 0 |a Very high speed integrated circuits 
991 |a MONOGRAPHS  |b 5  |c 2018-11-06 18:07:59  |d 2021-12-01 08:23:21  |e mut  |f n  |g null  |h n  |i a  |j m  |k    |l a  |m    |n a  |o    |p b  |q    |r mau  |s eng  |t 2002   |v RF measurements of die and packages / 

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