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Multichip modules and related technologies : MCM, TAB, and COB design / Gerald L. Ginsberg, Donald P. Schnorr

Main Author: Ginsberg, Gerald L.
Other Authors: Schnorr, Donald P.
Format: MONOGRAPHS
Language: English
Published: New York : McGraw-Hill, 1994
Series: Electronic packaging and interconnection series
Subjects: Electronic packaging.
Multichip modules (Microelectronics) -- > Design and construction.
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050 4 |a TK7870.15  |b G56M84 
100 1 |a Ginsberg, Gerald L. 
245 1 0 |a Multichip modules and related technologies : MCM, TAB, and COB design  |b /  |c Gerald L. Ginsberg, Donald P. Schnorr 
260 |a New York :  |b McGraw-Hill,  |c 1994 
300 |a xi, 290 p. :  |b illus., charts, tables ;  |c 23 cm. 
440 0 |a Electronic packaging and interconnection series 
504 |a Includes bibliographical references and index 
650 0 |a Electronic packaging. 
650 0 |a Multichip modules (Microelectronics) --  |x Design and construction. 
700 1 |a Schnorr, Donald P. 
991 |a MONOGRAPHS  |b 8  |c 2018-11-07 00:19:04  |d 2022-07-04 15:48:30  |e mut  |f n  |g null  |h n  |i a  |j m  |k    |l a  |m    |n a  |o    |p b  |q    |r nyu  |s eng  |t 1994   |v Multichip modules and related technologies : MCM, TAB, and COB design / 

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