Reliability of electronic packages and semiconductor devices / Giulio Di Giacomo
| Main Author: | Di Giacomo, Giulio |
|---|---|
| Format: | MONOGRAPHS |
| Language: | English |
| Published: |
New York : McGraw-Hill, 1997 |
| Subjects: |
Microelectronic packaging --
> Reliability.
Semiconductors -- > Reliability. |
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| 020 | |a 007017024X | ||
| 040 | |a DLC |c MUT | ||
| 050 | 4 | |a TK7871.85 |b D53R44 | |
| 100 | 1 | |a Di Giacomo, Giulio | |
| 245 | 1 | 0 | |a Reliability of electronic packages and semiconductor devices |b / |c Giulio Di Giacomo |
| 260 | |a New York : |b McGraw-Hill, |c 1997 | ||
| 300 | |a xiv, 410 p. : |b illus. ; |c 23 cm. | ||
| 504 | |a Includes bibliographical references and index | ||
| 650 | 0 | |a Microelectronic packaging -- |x Reliability. | |
| 650 | 0 | |a Semiconductors -- |x Reliability. | |
| 991 | |a MONOGRAPHS |b 7 |c 2018-11-07 00:32:53 |d 2022-06-28 15:34:24 |e mut |f n |g null |h n |i a |j m |k |l a |m |n a |o |p b |q |r nyu |s eng |t 1997 |v Reliability of electronic packages and semiconductor devices / | ||